Function Surface cleaning and activation for various materials such as plastics, metals, glasses, textiles, or films. Surface cleaning and modification for LCD, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED Packaging, SMT, PCB, FPC, etc. Improving surface roughness before printing, painting, gluing or bonding Features ‧Extremely high plasma uniformity. ‧No substrate damage by using low energy ions. ‧No contamination of substrates by high energy bombardments of electrodes. ‧Special plasma electrode design. ‧High density plasma source. ‧High plasma performance. ‧Well-controlled low ion energy. ‧Combination of chemical reactivity and physical bombardments ‧High cleaning efficiency. ‧Wide operation condition. ‧Multiple processing gases capable of achieving the best surface cleaning and treatment effects. ‧Fully automatic and user-friendly. ‧High reliability and easy maintenance. ‧Customization Application Industry Surface cleaning and modification for LCD, IC Packaging(Flip Chip, CSP, BGA, Lead Frame, etc.), LED Packaging, SMT, PCB, FPC, etc. Improving surface roughness before printing, painting, gluing or bonding.
